雜志介紹

Journal Of Micromechanics And Microengineering雜志介紹

《Journal Of Micromechanics And Microengineering》是一本(ben)以(yi)(yi)English為主的未開放獲取(qu)(qu)國際優秀期(qi)刊，中文名稱微機械與(yu)微工程(cheng)雜志，本(ben)刊主要出版、報道工程(cheng)技術-ENGINEERING, ELECTRICAL & ELECTRONIC領域的研(yan)(yan)究動(dong)態以(yi)(yi)及在該領域取(qu)(qu)得(de)的各方(fang)面(mian)的經驗和科研(yan)(yan)成果，介紹(shao)該領域有關本(ben)專(zhuan)業(ye)的最新進(jin)展，探討行業(ye)發(fa)展的思路和方(fang)法(fa)，以(yi)(yi)促進(jin)學術信(xin)息交流，提高行業(ye)發(fa)展。該刊已被國際權威數據庫SCIE收錄，為該領域相關學科的發(fa)展起到(dao)了(le)良(liang)好的推動(dong)作用，也得(de)到(dao)了(le)本(ben)專(zhuan)業(ye)人(ren)員的廣泛認可。該刊最新影響(xiang)因子為2.4，最新CiteScore 指數為4.5。

本刊近期中國(guo)學者發表的論(lun)文主要(yao)有：

• Loss mechanisms of multi-frequency whispering gallery mode RF-MEMS resonators

  Author: Liu, Wenli; Chen, Zeji; Lu, Yujie; Zhao, Junyuan; Zhu, Yinfang; Yang, Jinling; Yang, Fuhua

• Remote actuation based on magnetically responsive pillar arrays

  Author: Jiang, Wei; Wang, Lanlan; Chen, Bangdao; Liu, Hongzhong

• Fatigue life evaluation of gold wire bonding solder joints in MEMS pressure sensors

  Author: Zhang, Yunfan; Wu, Kangkang; Shen, Shengnan; Zhang, Quanyong; Cao, Wan; Liu, Sheng

• Topology optimization design of compliant amplification mechanisms with low parasitic displacement

  Author: Wang, Qiliang; Wei, Jianming; Long, Yiping; Tan, Jianping

英文介紹

Journal Of Micromechanics And Microengineering雜志英文介紹

Journal of Micromechanics and Microengineering (JMM) primarily covers experimental work, however relevant modelling papers are considered where supported by experimental data.

The journal is focussed on all aspects of:

-nano- and micro- mechanical systems

-nano- and micro- electomechanical systems

-nano- and micro- electrical and mechatronic systems

-nano- and micro- engineering

-nano- and micro- scale science

Please note that we do not publish materials papers with no obvious application or link to nano- or micro-engineering.

Below are some examples of the topics that are included within the scope of the journal:

-MEMS and NEMS:

Including sensors, optical MEMS/NEMS, RF MEMS/NEMS, etc.

-Fabrication techniques and manufacturing:

Including micromachining, etching, lithography, deposition, patterning, self-assembly, 3d printing, inkjet printing.

-Packaging and Integration technologies.

-Materials, testing, and reliability.

-Micro- and nano-fluidics:

Including optofluidics, acoustofluidics, droplets, microreactors, organ-on-a-chip.

-Lab-on-a-chip and micro- and nano-total analysis systems.

-Biomedical systems and devices:

Including bio MEMS, biosensors, assays, organ-on-a-chip, drug delivery, cells, biointerfaces.

-Energy and power:

Including power MEMS/NEMS, energy harvesters, actuators, microbatteries.

-Electronics:

Including flexible electronics, wearable electronics, interface electronics.

-Optical systems.

-Robotics.