雜志介紹

Soldering & Surface Mount Technology雜志介紹

《Soldering & Surface Mount Technology》是一本以(yi)English為主的(de)(de)(de)未開放獲(huo)取國(guo)際(ji)優(you)秀期(qi)刊，中文(wen)名(ming)稱焊接和(he)表面貼裝技(ji)術，本刊主要出版、報道材料(liao)科學(xue)-METALLURGY & METALLURGICAL ENGINEERING領(ling)域的(de)(de)(de)研究動(dong)(dong)態以(yi)及(ji)在該領(ling)域取得的(de)(de)(de)各方(fang)面的(de)(de)(de)經驗和(he)科研成果，介(jie)紹(shao)該領(ling)域有關本專(zhuan)業的(de)(de)(de)最(zui)(zui)(zui)新(xin)進展(zhan)(zhan)，探討行業發(fa)展(zhan)(zhan)的(de)(de)(de)思路和(he)方(fang)法，以(yi)促進學(xue)術信息交(jiao)流(liu)，提高行業發(fa)展(zhan)(zhan)。該刊已(yi)被(bei)國(guo)際(ji)權威(wei)數據(ju)庫SCIE收(shou)錄(lu)，為該領(ling)域相關學(xue)科的(de)(de)(de)發(fa)展(zhan)(zhan)起到了(le)良好的(de)(de)(de)推(tui)動(dong)(dong)作用，也得到了(le)本專(zhuan)業人員的(de)(de)(de)廣泛認可。該刊最(zui)(zui)(zui)新(xin)影響因子為1.7，最(zui)(zui)(zui)新(xin)CiteScore 指數為4.1。

英文介紹

Soldering & Surface Mount Technology雜志英文介紹

Soldering & Surface Mount Technology seeks to make an important contribution to the advancement of research and application within the technical body of knowledge and expertise in this vital area. Soldering & Surface Mount Technology compliments its sister publications; Circuit World and Microelectronics International.

The journal covers all aspects of SMT from alloys, pastes and fluxes, to reliability and environmental effects, and is currently providing an important dissemination route for new knowledge on lead-free solders and processes. The journal comprises a multidisciplinary study of the key materials and technologies used to assemble state of the art functional electronic devices. The key focus is on assembling devices and interconnecting components via soldering, whilst also embracing a broad range of related approaches.